Sintering of Glass Bonded Silicon Carbide

dc.contributor.author	Cigno, Patrick G.
dc.date.accessioned	2015-05-29T17:17:22Z
dc.date.available	2015-05-29T17:17:22Z
dc.date.issued	2015-05-12
dc.description	Thesis completed in partial fulfillment of the requirements for the Alfred University Honors Program.	en_US
dc.description.abstract	For applications where temperature is less than 1000_C, glass bonded SiC is an attractive option due to lower processing temperatures. To demonstrate this idea, clay was used to produce a glass phase during firing, resulting in amorphous grain boundaries on cooling. Results indicated that porosity was sensitive to clay concentration, but temperature had little effect. Samples containing 20% (by weight) clay had the lowest porosities (26-30%) and highest bulk densities; 5% (by weight) clay samples generated density levels averaging 58.50% of the theoretical, the lowest of all clay concentrations. Mullite and glass formation was temperature independent, which resulted constant skeletal density at all firing temperatures. These results offer the potential to tailor the porosity of sintered silicon carbide for less severe applications.	en_US
dc.identifier.uri	http://hdl.handle.net/10829/6844
dc.language.iso	en_US	en_US
dc.rights.uri	https://libraries.alfred.edu/AURA/termsofuse	en_US
dc.subject	Honors thesis	en_US
dc.subject	Silicon Carbide	en_US
dc.subject	Glass	en_US
dc.subject	Sintering	en_US
dc.title	Sintering of Glass Bonded Silicon Carbide	en_US
dc.type	Thesis	en_US

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